Sensor assemblies for electronic devices

ABSTRACT

Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user&#39;s experience.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. application Ser. No.16/586,678, filed Sep. 27, 2019, entitled “SENSOR ASSEMBLIES FORELECTRONIC DEVICES,” which is a continuation of U.S. application Ser.No. 15/844,162, filed Dec. 15, 2017, now U.S. Pat. No. 10,488,891 issuedNov. 26, 2019, which is a continuation of U.S. application Ser. No.15/449,810, filed Mar. 3, 2017, entitled “SENSOR ASSEMBLIES FORELECTRONIC DEVICES,” now U.S. Pat. No. 9,870,033 issued Jan. 16, 2018,which claims the benefit of U.S. Provisional Application No. 62/381,525,entitled “SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES” filed on Aug. 30,2016; U.S. Provisional Application No. 62/384,083, entitled “SENSORASSEMBLIES FOR ELECTRONIC DEVICES” filed on Sep. 6, 2016; and U.S.Provisional Application No. 62/424,300, entitled “SENSOR ASSEMBLIES FORELECTRONIC DEVICES” filed on Nov. 18, 2016, all of which are herebyincorporated by reference.

FIELD

The described embodiments relate to sensor assemblies suitable forconsumer electronic devices. According to some embodiments, the sensorassemblies include solid-state sensors, such as capacitive touchsensors.

BACKGROUND

Conventional mechanical switches are used in numerous applications inelectronic products. For example, many button and keyboard designsinclude mechanically based actuators that rely on relatively largemovements to complete electrical circuits. Advantages of mechanicalswitches include their low cost and ability to provide audible andtactile response to a user. However, mechanical switches are relativelylarge in size and, therefore, are difficult to integrate into productsthat have very limited space. This can be a major obstacle forintegrating into modern portable electronic products, which include amultitude of electronic components packed within small enclosures.Furthermore, mechanical switches can wear out quickly, and therefore mayneed frequent replacing. What are needed, therefore, are improved sensorand actuator designs for electronic devices.

SUMMARY

This paper describes various embodiments that relate to sensorassemblies for electronic devices. In particular embodiments, the sensorassemblies include solid-state sensors that require small deflectionsfor activation and have small cross-section profiles.

According to a further embodiment, an electronic device is described.The electronic device includes a speaker and a haptic component. Theelectronic device also includes a display cover that covers a display ofthe electronic device. The display cover has an opening. The electronicdevice further includes a sensor assembly for accepting input for theelectronic device. The sensor assembly includes a sensor coverpositioned within the opening of the display cover and having an outersurface configured to accept the input. The sensor assembly alsoincludes a sensor configured to detect the input. The sensor generatesone or more signals that activate the haptic component and the speakerin response to the input.

According to one embodiment, a sensor assembly for detecting andresponding to input is described. The sensor assembly includes a sensorcover having an exterior surface for accepting the input. The sensorassembly also includes a trim that encompasses a perimeter. The sensorassembly further includes a compliant member positioned between thesensor cover and a ledge of the trim. The compliant member is configuredto compress and provide a return force in response to the input. Thesensor assembly additionally includes a capacitive touch sensorconfigured to detect the input.

According to another embodiment, an electronic device is described. Theelectronic device includes a display cover that covers a display of theelectronic device. The display cover has an opening defining an interiorchamfered edge. The electronic device also includes a sensor assemblyfor accepting input for the electronic device. The sensor assemblyincludes a sensor cover positioned within the opening and having anouter surface configured to accept the input. The sensor assembly alsoincludes a trim positioned within the opening between the sensor coverand the display cover. The trim has an exterior chamfered edge thatengages with the interior chamfered edge of the display cover. Thesensor assembly further includes a sensor configured to detect theinput.

These and other embodiments will be described in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements.

FIGS. 1A and 1B show perspective views of consumer electronic devicesthat can include sensor assemblies described herein.

FIG. 2 shows an exploded view of a portion an electronic device with asensor assembly in accordance with some embodiments.

FIGS. 3A and 3B show top views of a sensor assembly portion of anelectronic device of show in FIG. 1A.

FIG. 4A shows a cross-section view of the sensor assembly portion of theelectronic device shown in FIG. 3B.

FIG. 4B shows a top view of an electronic device having a sensorassembly, a haptic engine and a speaker.

FIG. 5 shows a cross-section view of a sensor assembly portion of anelectronic device in accordance with some embodiments.

FIG. 6 shows a flowchart indicating a process for assembling a sensorassembly within an electronic device in accordance with someembodiments.

FIGS. 7A-7C show cross-section views of sensor assembly mountingconfigurations, in accordance with some embodiments.

FIGS. 8A-8E show cross-section views of sensor assembly sealingconfigurations, in accordance with some embodiments.

FIGS. 9A-9C show cross-section and top views of a trimless sensorassembly configuration, in accordance with some embodiments.

FIGS. 10A-10D show cross-section and top views of a vibrating sensorassembly configuration, in accordance with some embodiments.

FIGS. 11A-11C show cross-section views of sensor assemblies havingdifferent sensing configurations, in accordance with some embodiments.

FIG. 11D shows a perspective view of a bracket as part of sensorassembly configuration of FIG. 11C, in accordance with some embodiments.

FIGS. 12A and 12B show cross-section views of a portion of an electronicdevice with a sensor assembly before and during a bonding operation,respectively.

FIGS. 13A-13F show sensor assembly configurations for preventingadhesive overflow from occurring during a bonding operation, inaccordance with some embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

Described herein are features of sensor assemblies that are well suitedfor consumer products, such as portable electronic devices. According tosome embodiments, the sensor assemblies include solid-state sensors.Compared to conventional mechanical switches and buttons that depend onphysical contact between contact pads, solid-state sensors utilizevoltage or capacitive changes to switch between on and off modes. Thisaspect makes solid-state sensors less likely to wear out compared tomechanical switches. In addition, solid-state sensors are generally morecompact than mechanical switches and buttons, making them well suitedfor integration within small form factor enclosures, such as those forportable electronic devices.

Furthermore, solid-state pressure sensor designs can require very smallmovements and forces in order to activate compared to mechanicalswitches and buttons. Since the sensor assemblies involve minimal orlittle movement (e.g., 10 micrometers or less, sometimes 5 micrometersor less), a user may not perceive movement of the sensor assembly (e.g.,button) itself when pressed. Thus, the sensor assembly can be configuredto provide tactile feedback (output) to the user in response to a user'stouch input, which this gives the user the experience that the buttonhas been depressed and activated, even if the sensor assembly barelymoves. Examples of tactile feedback can include haptic (e.g., vibratory)feedback. In some instances, a signal to the user is in the form ofacoustic or sonic feedback (i.e., makes a sound). In some cases, thesensor assembly is configured to provide a combination of tactile andacoustic feedback. These feedback features can mimic the experience ofactivating a mechanical switch or button, thereby providing a pleasingexperience for a user. Furthermore, the sensor assembly can providetactile feedback in response to a user's tactile input (e.g., user'stouch), giving the user an engaging and satisfying sensation andexperience with the electronic device.

The sensor assemblies described herein can include a number of featuresthat enhance performance of the sensor assemblies when integrated withinelectronic devices. For example, a trim that surround a sensor cover orcap can prevent lateral movement of the sensor assembly and isolatemovement of portions of the sensor assembly to a direction toward oraway from a touch sensor.

The sensor assemblies described herein are well suited for integrationinto consumer products such as computers, portable phones, tabletdevices, wearable electronic devices, and electronic device accessories,such as those manufactured by Apple Inc., based in Cupertino, Calif.

These and other embodiments are discussed below with reference to FIGS.1A-13F. However, those skilled in the art will readily appreciate thatthe detailed description given herein with respect to these Figures isfor explanatory purposes only and should not be construed as limiting.

FIGS. 1A and 1B show consumer products than can include sensorassemblies such as those described herein. FIG. 1A shows portable phone102, and FIG. 1B shows tablet computer 104, each of which includessensor assemblies 106 configured to sense input from a user. Sensorassemblies 106 can be configured to activate one or more electricalcircuits within respective devices 102 or 104, and therefore may bereferred to as button assemblies or switch assemblies. For example,sensor assemblies 106 may be configured to activate aspects of displays108 of devices 102 and 104, respectively. Sensor assemblies 106 can bedesigned to cosmetically enhance the appearance of enclosures 110 ofdevices 102 and 104. In some cases, sensor assemblies 106 are integratedwith display covers 112 of enclosures 110.

Sensor assemblies 106 can include one or more sensors for detecting ofinput (e.g., touch, push, motion, light). In some cases, the sensorsincludes one or more capacitive, piezoelectric and piezoresistivesensors. In some cases, sensor assemblies 106 are configured to provideoutput to a user, such as haptic or acoustic feedback, to indicate thatsensor assemblies 106 are activated in response to the input. In someembodiments, sensor assemblies 106 include fingerprint sensors that candetect and distinguish between fingerprints of different users. Itshould be noted that the sensor assemblies described herein can beintegrated within any suitable electronic device and are not limited todevices 102 and 104 shown in FIGS. 1A and 1B. For example, the sensorassemblies can be implemented in laptop computers or wearable electronicdevices.

FIG. 2 shows an exploded view of a portion of an electronic device(e.g., portable phone 102), showing how sensor assembly 106 isconfigured to fit within opening 201 of display cover 112. Display cover112 can correspond to a transparent or partially transparent materialthat covers and protects an underlying display assembly. Display cover112 can be composed of glass (e.g., sapphire), plastic, ceramic, and/orother suitable material. In some cases, display cover 112 is coupledwith another portion of an enclosure for the portable phone (e.g., ametal portion of the enclosure) using fastening features 208. Bracket210 can be used to secure sensor assembly 106 to display cover 112 viafasteners 211. It should be noted that the sensor assembly 106 can beinserted within an opening of any suitable portion of an electronicdevice and is not limited to integration with a display cover. Forexample, sensor assembly 106 can be inserted within an opening of anon-transparent enclosure wall of an electronic device.

As shown, sensor assembly 106 can in a pre-assembled in modular form forease of assembly into an electronic device. Sensor assembly 106 includessensor portion 205 and cable portion 207. Sensor portion 205 can includea sensor that is configured to detect input (e.g., touch, push, motion,light). In some cases the sensor is configured to detect touch or pushinput from a user's finger. In some instances the sensor includes one ormore capacitive, piezoelectric and piezoresistive sensors. In somecases, sensor assembly 106 includes a fingerprint sensor configured todetect a users fingerprint. Cable portion 207 can include wiring thatelectrically connects sensor portion 205 to other electrical componentswithin the electronic device. In some embodiments, cable portion 207includes one or more flexible (flex) cables. Sensor cover 202corresponds to a cosmetic cover having an exterior or outer surfaceconfigured to accept input. In some embodiments, sensor cover 202 is atleast partially transparent such that an underlying fingerprint sensorcan detect patterns of the user's fingerprint.

A perimeter of sensor cover 202 is encompassed by trim 204, which cancorrespond to a rigid ring or frame having an aperture to accommodatesensor cover 202. In some cases, an intermediate layer, such as anadhesive or polymer layer, is positioned between sensor cover 202 anddisplay cover 112. In other cases, trim 204 is configured to directlyengage with sensor cover 202 and display cover 112 so as to provide atight fit. In some embodiments, trim 204 is composed of a metalmaterial, which can provide sufficient rigidity without being toobrittle. However, in some cases trim is composed of other rigidmaterials such as polymer or ceramic materials. As described in detailbelow, trim 204 can limit motion of the sensor assembly 106 onceassembled within display cover 112. In addition, trim 116 is visible toa user, and therefore can enhance the appearance of sensor assembly 106.Due to its multiple functions, trim 116 can be referred to as a bracket,brace, support, washer, ring, band or other suitable term.

Sensor assembly 106 can be configured for easy assembly and disassembly.For example, sensor assembly 106 can be assembled from the top side ofopening 201, and bracket 210 can be assembled from the bottom side ofopening 201, as shown in FIG. 2. Bracket 210 can be composed of metalthat is grounded to the enclosure of electronic device, andnon-conductive portion 212 of bracket 210 electrically isolates theconductive portions of bracket 210 from sensor assembly 106. Since cableportion 207 should be positioned beneath display cover 112, cableportion 207 can be threaded through opening 201, then trim 204 andsensor cover 202 can be adjusted to fit snugly within opening 201.Fasteners 211 can then be used to secure bracket 210, which supportssensor assembly 106, to display cover 112. In the embodiment of FIG. 2,fasteners 211 are screws, but may alternatively or additionally includeclips, press-fit fasteners, welds, or other suitable fasteners. In somecases, fastener 211 a is aligned with a center of opening 201 and sensorcover 202.

It should be noted that the shape of sensor assembly 106 could varydepending on design requirements. In particular, sensor cover 202 andtrim 204 are not limited to round or circular forms as shown. Forexample, sensor cover 202 and trim 204 can have rectangular, triangular,oval or any other suitable shapes.

FIGS. 3A and 3B show top views of a portion of electronic device 102having sensor assembly 106. FIG. 3B shows sensor assembly 106 withsensor cover 202, and FIG. 3A shows sensor assembly 106 without sensorcover 202. FIG. 3A shows that sensor component 304 is positioned beneathsensor cover 202. In some embodiments, sensor component 304 is afingerprint sensor or touch sensor. Surrounding sensor component 304 iscompliant member 302, which corresponds to one or more layers ofcompliant or resilient material, such a silicone or other polymer. Insome cases, compliant member 302 includes separate pieces—in this case,four circle segment-shaped pieces to accommodate a rectangular-shapedsensor component 304. It should be noted, however, that compliant member302 can have any suitable shape and include any suitable number ofpieces. FIG. 3B shows sensor assembly 106 fully assembled withinelectronic device 102. As shown, sensor cover 202 is surrounded by trim204, both of which are exposed to a user of electronic device 102.Sensor cover 202 also provides a contact surface for a user to contactand activate sensor assembly 106.

FIG. 4A shows a cross-section view (A-A in FIG. 3B) of a portion ofelectronic device 102, showing how sensor assembly 106 can be assembledwithin electronic device 102, in accordance with some embodiments. Trim204 is positioned between sensor cover 202 and display cover 112, whichis, in turn, coupled to enclosure portion 110. As shown, sensor assembly106 has a very thin cross-section, thereby making room for componentssuch as component 414. In one particular embodiment, component 414 is adriver as part of a display assembly. Trim 204 includes ledge 404, whichsupports the backside of sensor cover 202. Compliant member 302, whichhas a thickness t, is positioned between sensor cover 202 and ledge 404of trim 204. Compliant member 302 can be adhered to sensor cover 202 andledge 404 by adhesive layers (not shown), such as layers of heatactivated film, pressure sensitive adhesive, liquid adhesive, or othersuitable adhesive material. In some embodiments, compliant member 302includes holes or channels that accommodate overflow of the adhesive.

Inset 400 shows a detail cross-section view of a stack up of sensorassembly 106. Beneath sensor cover 202 is fingerprint sensor 304, whichis configured to scan a fingerprint of a user through sensor cover 202.In some cases, fingerprint sensor 304 is a silicon chip having an arrayof capacitors and that is in communication with software that cancapture a user's fingerprint image and match it with stored fingerprintdata. Fingerprint sensor 304 can be coupled to sensor cover 202 byadhesive 407, which can be an optically transparent adhesive or othersuitable adhesive.

Beneath fingerprint sensor 304 is touch sensor 402, which in theembodiment of FIG. 4A is a capacitive touch sensor that includes firstlayer 402 a and second layer 402 b. Capacitor module 423 is associatedwith touch sensor 402. In some embodiments, first layer 402 a and secondlayer 402 b each correspond to flat flexible materials that include alayer of conductive material (e.g., copper) or other suitable material(e.g., indium tin oxide (ITO)) that are capacitively coupled withrespect to one another. First layer 402 a is physically coupled tofingerprint sensor 304 by first adhesive layer 408, and second layer 402b is physically coupled to stiffener 405 by second adhesive layer409—which can be different or the same types of adhesives. First layer402 a and second layer 402 b are spaced apart by gap 406 having adistance d such that a change in distance d is detected by a voltage orcapacitive change. Distance d can vary depending on design andmanufacture of touch sensor 402. Gap 406 can be filled with air or othera non-conductive material, such as a compliant gel. In some embodiments,air is found to provide better sensing capability than a gel.

When a user touches exterior surface 413 of sensor cover 202, the forceis transferred to first layer 402 a in a direction 403 toward sensor 402(referred to as a sensing direction) and into a pressed position. This,in turn, causes a corresponding reduction in distance d betweencapacitive layers 402 a and 402 b, thereby causing a change in voltageor capacitance in touch sensor 402. Touch sensor 402 then generates asignal that activates one or more electrical circuits of electronicdevice 102. Compliant member 302 is composed of a compliant materialthat provides a resistive force (opposite sensing direction 403) thatreturns sensor cover 202, and therefore also first layer 402 a, back toits un-pressed position. Once sensor cover 202 is back in its un-pressedposition, compliant member 302 returns to its full thickness t. Sincethere is very little space for compliant member 302, thickness t shouldbe very thin. In some cases, thickness is no more than about 500micrometers—in some cases, ranging from about 50-100 micrometers.

The change in distance d sufficient to cause activation of touch sensor402 will depend on the design of touch sensor 402. In general, therequired change in distance d will be very small. In some cases, thechange in distance d is about 2-3 micrometers (corresponding to acompliance of about 5-10 nm/gram-force for touch sensor 402). Ledge 404of trim 204 acts as a hard stop that prevents the amount of movement ofsensor cover 202 in sensing direction 403. In particular, ledge preventsfirst layer 402 a from contacting second layer 402 b, or otherwiseallowing first layer 402 a to come too close to second layer 402 b. Insome cases, deflection in the material of sensor cover 202 when pressedby a user can also contribute to changes in distance d. However, thisaspect can be factored into the design of sensor assembly 106. In someembodiments, sensor cover 202 is composed of a rigid material, such asglass (e.g., sapphire), ceramic or rigid polymer, so as to reducematerial deflection effects of sensor cover 202. In some embodiments,sensor cover 202 moves from the un-pressed position to the pressedposition by a distance of less than about 50 micrometers sensingdirection 403. In some cases, sensor cover 202 moves from the un-pressedposition to the pressed position by a distance of less than about 10micrometers. In a particular embodiment, sensor cover 202 moves from theun-pressed position to the pressed position by a distance of about 4micrometers.

Note that the embodiments described herein are not limited to capacitivesensors. For example, instead of, or in addition to, a capacitive touchsensor 402, sensor assembly 106 can include a piezoelectric orpiezoresistive sensor. That is, any suitable solid-state sensors may beused.

Compared to conventional mechanical switches and buttons, sensorassembly 106 requires very little physical movement with the assemblyitself for activation. This allows for sensor assembly 106 to have amuch more compact cross-section (z-stack) compared to mechanicalswitches and buttons, thereby providing more room for other componentswithin electronic device 102, such as component 414. Furthermore, sensorassembly 106 may not depend on mechanical contact within touch sensor402. Instead, sensor 402 can utilize small voltage or capacitancechanges brought about by a relatively small force input, which may beaccomplished using a solid-state sensor. In general, solid-statesensors, such as capacitive touch, piezoelectric and piezoresistivesensors, can include electrical circuits built within solid material,such as semiconductor materials. The relatively non-mechanical aspect ofsolid-state sensors can make sensor assembly 106 less likely to wear outcompared to conventional mechanical switches and buttons. Moreover,since sensor assembly 106 may require a small force for activationcompared to mechanical switches and buttons, this can provide an easierinput means for electronic device 102 and a better user experience.Furthermore, since the solid-state sensor can require less movement inthe sensing direction 403 compared to mechanical switches, thecross-section of sensor assembly 106 can be smaller (thinner) than thatof a mechanical switch assembly.

Other design considerations include features that isolate movement ofsensor cover 202 when transitioning between the pressed and un-pressedpositions. For example, tight engagement of trim 204 with display cover112 and sensor cover 202 prevents lateral movement of sensor assembly106 with respect to sensing direction 403. Thus, trim 204 should have asize and shape in accordance with the size and shape of each of sensorcover 202 and the opening of display cover 112. Furthermore, stiffener405 provides rigid support for second layer 402 b of touch sensor 402.Stiffener 405 is coupled to trim 204 via fastening members 418, which insome embodiments are weld spots. This is because in some cases weldingis found to provide the strongest bond and provide the most reliablerigidity within the limited space provided for sensor assembly 106. Thecombination of the above structural features and bracket 210 preventssensor assembly 106 from encroaching into internal cavity 412 and makingcontact with component 414 during drop events and other large forceevents.

In the embodiment of FIG. 4A, trim 204 has a chamfered edge 410 thatcorresponds to a chamfered edge 411 of display cover 112. This chamfereddesign creates a hard stop such that sensor assembly 106 is not able tointrude within internal cavity 412 of enclosure 110. In particular,although bracket 210 and fastener 211 a support and secure sensorassembly 106 to display cover 112, the matching chamfered geometries oftrim 204 and display cover 112 further prevent shifting of sensorassembly 106 and encroachment of sensor assembly 106 into internalcavity 412. These chamfered geometries can have an advantage over astepped geometry for manufacturing purposes. In particular, a steppedgeometry is more difficult to polish than a chamfered geometry.Furthermore, the angled geometry allows for more flexibility with regardto stack up tolerance compared to stepped geometry. In some embodiments,chamfered edges 410 and 411 are each chamfered by about 45 degrees withrespect to outer surface 425 of display cover 112. In some embodiments,sensor assembly 106 is installed such that exterior surface 413 ofsensor cover 202 is slightly recessed with respect to outer surface 425of display cover 112 (in some cases, recessed by about 100 micrometers).This recessed configuration of sensor cover 202 can help preventinadvertent activation (i.e., false triggers) of sensor assembly 106.

In some embodiments, sensor assembly 106 is configured to providefeedback to a user. For example, sensor assembly 106 can be electricallycoupled to haptic actuator 415 (which can be referred to as a hapticcomponent) that causes electronic device 102 to vibrate. This type ofhaptic feedback is sometimes referred to as taptic feedback, and hapticactuator 415 can be referred to as a taptic engine. Additionally oralternatively, sensor assembly 106 can be electrically coupled tospeaker 416 that provides acoustic feedback to the user. In some cases,the combination of both haptic feedback and acoustic feedback creates anexperience for a user that mimics depression of a mechanical button orswitch. In one embodiment, sensor assembly 106 causes speaker 416 toproduce a very quiet, high pitch and crisp sound that mimics the soundof mechanical button being pressed, and causes haptic actuator 415 toproduce a very brief vibration that mimics the feel of a mechanicalbutton being pressed. In some cases, haptic actuator 415 is able tovibrate and also produce a sound without the addition of sound fromspeaker 416.

Haptic actuator 415 and speaker 416 can be located in any suitable partof electronic device 102. For example, haptic actuator 415 canpositioned at a distal side (not shown) of electronic device 102 withrespect to sensor assembly 106, and can be activated by other electroniccomponents of electronic device 102. Likewise, speaker 416 can bepositioned on a sidewall (not shown) of electronic device 102, and canbe used to provide other sounds (e.g., ring tones and alerts) to a user.That is, sensor assembly 106 can activate haptic actuator 415 and/orspeaker 416, which are already components of electronic device 102 forother purposes. In other embodiments, haptic actuator 415 and/or speaker416 are dedicated feedback components for sensor assembly 106. In thesedesigns, it may be beneficial to position haptic actuator 415 and/orspeaker 416 adjacent to sensor assembly 106.

In some embodiments, one or more sealing features provide a moisturebarrier from the external environment. For example, seal 420 positionedaround an internal perimeter of trim 204 adjacent to compliant member302 can prevent moisture from the external environment from enteringbetween sensor cover 202 and trim 204 and contacting fingerprint sensor304 or touch sensor 402, or from entering internal cavity 412. Sinceseal 420 is positioned adjacent to compliant member 302, the material ofseal 420 should be compliant enough to prevent interference with thecompressing and decompressing of compliant member 302. In some cases,seal 420 is composed of a very compliant polymer adhesive, such as asilicone-based adhesive.

Seal 421 can prevent moisture from entering internal cavity 412 betweentrim 204 and display cover 112. In some cases, seal 421 is in the formof an O-ring that is positioned within groove 422 at an outer perimeterof trim 204. If seal 421 is an O-ring, the diameter of the O-ring mayneed to be smaller than conventionally manufactured since space is solimited in and around sensor assembly 106. In a particular embodiment,the diameter of the O-ring seal 421 is less than about 0.5 millimeters.

FIG. 4B shows a top view of a portion of device 102 indicating locationof sensor assembly 106 in relation to haptic actuator 415 and speaker416, in accordance with some embodiments. As shown, haptic actuator 415and speaker 416 can be separate electronic components housed withinenclosure 110. In some cases, haptic actuator 415 and speaker 416 arepositioned proximate to and partially under sensor assembly 106. In someinstances, haptic actuator 415 and speaker 416 each serve functionsother than solely dictated by sensor assembly 106. For example, hapticactuator 415 can provide tactile feedback to a user (e.g. by vibratingenclosure 110) in response to other types of input from a user, such astouch input from the user contacting display 417, or any other suitablesignal as dictated by device 102 (e.g. phone call, text messages, alarm,etc.). In some cases haptic actuator 415 makes a sound when vibrating,thereby also providing acoustic feedback to a user. Speaker 416 can bearranged to produce sound that is directed through one or more openings419 within enclosure 110. Speaker 416 can produce sound 427 in responseany suitable signal as dictated by device 102 (e.g. user input, phonecall, text messages, alarm, etc.). Thus, haptic actuator 415 and speaker416 can each have multiple uses and are not solely dedicated to theservice of sensor assembly 106. In some embodiments, however, hapticactuator 415 and speaker 416 are fully dedicated to the responding tosignals from sensor assembly 106.

It should be noted that the locations of haptic actuator 415 and speaker416 of device 102 can vary depending on design needs and are not limitedto the locations depicted in FIG. 4B. In some designs it may bebeneficial to have haptic actuator 415 and speaker 416 positionedproximate to sensor assembly 106 so that the user can more readilyassociate vibrations of haptic actuator 415 and noises of speaker 416with pressing of sensor assembly 106. However, in some cases, it may bebeneficial to have haptic actuator 415 and speaker 416 positioned indifferent locations within device 102. For example, in some designs oneor both haptic actuator 415 and speaker 416 can be located at anopposing side of device 102 than the location of sensor assembly 106.Furthermore, the number of haptic actuators 415 and speakers 416 canvary, depending on desired user experience and design requirements.

FIG. 5 shows a cross-section view of a portion of electronic device 500,which includes sensor assembly 506, in accordance with some embodiments.Sensor assembly 506 is assembled within an opening of enclosure portion512. In some embodiments, enclosure portion 512 corresponds to a displaycover that covers a display assembly of electronic device 500. Sensorassembly 506 includes fingerprint sensor 524 and touch sensor 522.Fingerprint sensor 524 is configured to recognize fingerprint featuresof a user through sensor cover 502. Touch sensor 522 is configured todetect input, such as from a user's finger touching exterior surface 513of sensor cover 502. Touch sensor 522 can be any suitable solid-statesensor capable of detecting a touch input. In some embodiments, touchsensor 522 includes one or more of a capacitive sensor, piezoelectricsensor and piezoresistive sensor. The small cross-section of sensorassembly 506 allows for more room within enclosure 512 for othercomponents, such as electronic component 514.

Trim 504 encompasses a perimeter of sensor cover 502 and isolatesmovement of the sensor cover 502 between a pressed position and anun-pressed position. In particular, trim 504 prevents lateral movementof sensor cover 502 so as to limit movement of sensor cover 502 tosensing direction 503 (toward touch sensor 522) and a direction oppositesensing direction 503 (away from touch sensor 522). Compliant member 508is positioned between sensor cover 502 and ledge 532 of trim 504.Compliant member 508 can be in the form of a single piece or multiplepieces (e.g., see compliant member 302 in FIG. 3A). When a user appliesa force on exterior surface 513 of sensor cover 502, thickness t ofcompliant member 508 compresses accordingly. Compliant member 508 isconfigured to provide a return force that returns sensor cover 502 backto the un-pressed position from the pressed position.

Sensor cover 502 is coupled to first layer 522 a of touch sensor 522,and stiffener 505 is coupled to second layer 522 a of touch sensor 522.Stiffener 505 is rigidly coupled to enclosure portion 512 via trim 504,thereby keeping second layer 522 b stationary with respect to enclosureportion 512. Thus, when sensor cover 502 moves in sensing direction 503to a pressed position in response to a force, distance d of gap 507between first layer 522 a and second layer 522 a is reduced, therebycausing a voltage or capacitance shift within touch sensor 522. In somecases, this voltage or capacitance change causes touch sensor 522 togenerate a signal that activates one or more components. When compliantmember 508 returns sensor cover 502 to the un-pressed position, gap 507returns to its original distance d, thereby returning the voltage orcapacitance to the original voltage. In some cases, the voltage orcapacitance change causes touch sensor 522 to generate a signal thatdeactivates the one or more components, and/or that activates one ormore other components.

In some embodiments, sensor assembly 506 is electrically coupled tohaptic actuator 515 and/or speaker 516. This configuration allows atouch event from a user to be associated with haptic and/or acousticfeedback to the user. For example, sensor assembly 106 can cause speaker516 to produce a clicking sound, and/or cause haptic actuator 515 toproduce a very brief vibration that simulates pushing of a mechanicalswitch. Haptic actuator 515 and speaker 516 can be part of sensorassembly 506 itself, or be situated in a different region of electronicdevice 500.

FIG. 6 shows a flowchart indicating a process for assembling a sensorassembly within an electronic device. At 602, a trim is positionedaround a perimeter of a sensor cover of a sensor assembly. The sensorcover can have a round, rectangular, triangular, oval or other suitableshape, with the trim having a correspondingly shaped aperture. At 604,one or more moisture seals positioned around the trim. In oneembodiment, moisture seal has an O-ring shape and is positioned within agroove at an outer perimeter of the trim. The moisture seal can becomposed of a compliant material, such as silicon or other polymermaterial.

At 606, the sensor assembly is positioned within an opening of anenclosure for an electronic device. The sensor assembly can be assembledwithin a wall of the enclosure, such as a transparent, glass displaycover for the electronic device, or an opaque metal or plastic wall ofthe enclosure. The opening should have a shape corresponding to that ofthe outer perimeter of the trim such that a tight fit between the two isachieved. In some cases, the sensor assembly is assembled from a topside of the opening while a bracket is assembled from a bottom side ofthe opening 201. In some cases, this involves bending and threading acable portion of the sensor assembly within the opening before adjustingthe trim and the sensor cover snugly within opening. In some cases, atop surface of the sensor cover is recessed with respect to a topsurface of the enclosure.

At 608, the sensor assembly is secured to the enclosure. In someembodiments, the bracket supports a bottom portion of the sensorassembly with respect to the enclosure. Fasteners, such as screws orwelds, can be used to secure the bracket and the sensor assembly to theenclosure. In some cases, the fasteners are tightened in a manner suchthat chamfered interfaces between the trim and enclosure tightly engagewith one another.

FIGS. 7A-7C show cross-section views of sensor assembly mountingconfigurations, in accordance with some embodiments. FIG. 7A showssensor assembly 706, which is assembled within electronic device 700.Sensor assembly 706 includes sensor cover 702 having a perimeter that isencompassed by trim 704. Trim 704 is positioned between and engages bothsensor cover 702 and enclosure portion 712. In some embodiments,enclosure portion 712 corresponds to a display cover that covers adisplay assembly of electronic device 700. As show, trim 704 has achamfered edge 707, which engages with corresponding chamfered edge 708of enclosure portion 712. In some cases, the geometries of chamferededges 707 and 708 are chosen such that exterior surface 711 of sensorcover 702 is recessed with respect to exterior surface 713 of enclosureportion 712. The chamfered edge mounting configuration shown in FIG. 7Ais similar to that of FIG. 4A, described above.

One of the advantages of the mounting configuration of FIG. 7A ischamfered edge 707 of trim 704 can secure sensor cover 702 around itsfull perimeter, thereby preventing a user from being able to push sensorassembly 706 into internal cavity 715 or putting pressure ontoelectronic component 714. This can be of particular importance ifelectronic component 714 includes relatively fragile components, such asa silicon chip. In some embodiments, electronic component 714 includes adriver as part of a display assembly. Furthermore, chamfered edges 707and 708 secures sensor assembly 706 so well that sensor assembly 706does not encroach within cavity 715 or put significant pressure onelectronic component 714 even when electronic device 700 experiences adrop event or other high impact events. Another advantage of themounting configuration of FIG. 7A is that chamfered edges 707 and 708can localize the pressure from a user's finger in a sensing direction703.

FIG. 7B shows sensor assembly 726 is assembled within electronic device720. Instead of a trim, sensor assembly 726 is supported by back plate724. Back plate 724 is coupled to both sensor cover 722 and enclosureportion 732, and is positioned below sensors 726 and 727. In someembodiments, sensor 726 corresponds to a portion of a touch sensor andsensor 727 corresponds to a portion of a fingerprint sensor. Back plate724 can be coupled to enclosure portion 732 and/or sensor cover 722 byan adhesive or by engagement from an insert molding process. Forexample, back plate 724 can be composed of a plastic material that ismolded onto enclosure portion 732. In some embodiments, exterior surface731 of sensor cover 722 is recessed with respect to exterior surface 733of enclosure portion 732.

One of the advantages of the mounting configuration of FIG. 7B is thatback plate 724 can be not visible to a user, which may provide acosmetic advantage in some applications. Furthermore, this configurationcan localize the pressure from a user's finger to a sensing direction723. Moreover, because of its position, back plate 724 can providestrong support for sensor assembly 726 such that sensor assembly 726does not encroach in internal cavity 735 or contact electronic component734. However, this configuration may provide less support at the top ofsensor assembly 726 than those embodiments that include a trim. Thisfactor may not be important, however, depending on the particularapplication and other design considerations of electronic device 720.

FIG. 7C shows sensor assembly 746 is assembled within electronic device720. In this embodiment, enclosure portion 752 corresponds to a displaycover that covers a display assembly of electronic device 740. In aparticular embodiment, at least part of enclosure portion 752 is atleast partially transparent such that the underlying display is viewablethrough enclosure portion 752. Instead of a separate sensor cover,enclosure portion 752 covers sensor assembly 746. That is, part ofenclosure portion 752 acts as a sensor cover. In some embodiments, theportion covering sensor assembly 746 is locally thinned so as to providea recess 742 within enclosure portion 752. Recess 742 may be detectableby a user when the user touches enclosure portion 752 (and in some casesvisually detectable by a user) and act as a guide so that the user canlocate sensor assembly 746. In other embodiments, recess 742 is locatedwithin an interior surface of enclosure portion 752 (i.e., backside ofenclosure portion 752 adjacent to sensor 747.

One of the advantages of the mounting configuration of FIG. 7C is thatenclosure portion 752 provides a continuous surface that covers thedisplay and sensor assembly 746 of electronic device 740. This canprovide good protection to sensor assembly 746 from liquids or otheragents without the use of seals. Furthermore, the continuous surface ofenclosure portion 752 may be cosmetically appealing in someapplications. However, this configuration may limit the movement ofsensor assembly 746 in sensing direction 743. In particular, sinceenclosure portion 752 cover sensor assembly 746, movement of sensorassembly 746 in sensing direction 743 depends on deflection of thematerial of enclosure portion 752, which can limit the amount ofmovement in sensing direction 743. Depending on the material ofenclosure portion 752, this can make it more difficult for a user todepress sensor assembly 746 sufficiently for actuation. Furthermore, ifthe material of enclosure portion 752 is sufficiently flexible, a user'stouch input may cause sensor assembly 746 to encroach into internalcavity 755 or touch electronic component 754. These factors may not beimportant, however, depending on the particular application and otherdesign considerations of electronic device 740.

FIGS. 8A-8E show cross-section views of sensor assembly sealingconfigurations, in accordance with some embodiments. FIG. 8A showssensor assembly 806 positioned within an opening of enclosure portion812 of electronic device 800. For simplicity, sensor assembly 806 andtrim 804 are shown as a single block. Inset 802 shows a detailed view ofan interface region between trim 804 and enclosure portion 812, at whichseal 808 is positioned. Seal 808 prevents moisture from entering betweentrim 804 and enclosure portion 812. In some cases, seal 808 is in theform of an O-ring that is positioned within groove 810 at an outerperimeter of trim 804. The embodiment shown in FIG. 8A has a similarsealing configuration as that of FIG. 4A.

FIG. 8B shows sensor assembly 826 positioned within an opening ofenclosure portion 832 of electronic device 820. For simplicity, sensorassembly 826 and trim 824 are shown as a single block. Inset 822 shows adetailed view of an interface region between trim 824 and enclosureportion 832, at which adhesive 828 is positioned Like seal 808 describedabove, adhesive 828 prevents moisture from entering between trim 824 andenclosure portion 832. Adhesive 828 can be composed of any suitableadhesive, including one or more of heat activated film, pressuresensitive adhesive, liquid adhesive, or other suitable adhesivematerial. In some embodiments, trim 834 includes groove 830 thataccommodates adhesive 828.

FIG. 8C shows sensor assembly 846 positioned within an opening ofenclosure portion 852 of electronic device 840. For simplicity, sensorassembly 846 and trim 844 are shown as a single block. Inset 842 shows adetailed view of an interface region between trim 844 and enclosureportion 852, at which adhesive 848 is positioned. Adhesive 848 preventsmoisture from entering between trim 844 and enclosure portion 852.Adhesive 848 can be composed of any suitable adhesive, including one ormore of heat activated film, pressure sensitive adhesive, liquidadhesive, or other suitable adhesive material. In the embodiment of FIG.8C, adhesive 848 is positioned within space 850 between trim 844 andenclosure portion 852. The magnitude of space 850 depends on an offsetof chamfer 853 of trim 844 and chamfer 855 of enclosure portion 852. Inone embodiment, chamfer 853 of trim 844 is larger than chamfer 855 ofenclosure portion 852.

FIG. 8D shows sensor assembly 866 positioned within an opening ofenclosure portion 872 of electronic device 860. For simplicity, sensorassembly 866 and trim 864 are shown as a single block. Inset 862 shows adetailed view of an interface region between trim 864 and enclosureportion 872. Gasket 868 is positioned on interior surfaces of trim 864and enclosure portion 872, and is configured to prevent moisture fromentering between trim 864 and enclosure portion 872. Gasket 868 can becomposed of any suitable material, including one or more polymermaterials, such as silicone. In some cases, gasket 868 is adhered tointerior surfaces of trim 864 and/or enclosure portion 872 by anadhesive. In some embodiments, gasket 868 is composed of a waterproofplastic and is adhered to interior surfaces of trim 864 and enclosureportion 872 via a stack of adhesives. Since gasket 868 is accessiblefrom the interior of the enclosure, this configuration allows gasket 868to be assembled before or after assembling sensor assembly 866.

FIG. 8E shows sensor assembly 886 positioned within an opening ofenclosure portion 892 of electronic device 880. For simplicity, sensorassembly 886 and trim 884 are shown as a single block. Inset 882 shows adetailed view of an interface region between trim 884 and enclosureportion 892. Potting 888 is positioned on interior surfaces of trim 884and enclosure portion 892, and is configured to prevent moisture fromentering between trim 884 and enclosure portion 892. Potting 888 caninclude one or more an adhesive material that is applied to interiorsurfaces of trim 864 and/or enclosure portion 872. Potting 888 should beapplied in a sufficiently flowable state such that portions of potting888 flows between trim 864 and/or enclosure portion 872. Once dried andhardened, potting 888 provides sufficient sealing. Potting 888 can beapplied before or after assembling sensor assembly 886.

FIGS. 9A-9C show cross-section and top views of electronic device 900having a trimless sensor assembly configuration, in accordance with someembodiments. FIGS. 9A and 9B show top views of a portion of electronicdevice 900 having sensor assembly 906. FIG. 9A shows sensor assembly 906with sensor cover 902, and FIG. 9B shows sensor assembly 906 withoutsensor cover 202. FIG. 9C shows cross-section view at B-B of FIG. 9A.

FIG. 9A shows that sensor cover 902 is adjacent to display cover 912without a trim between them. FIG. 9B shows that sensor component 904 ispositioned beneath sensor cover 902. In some embodiments, sensorcomponent 904 is a fingerprint sensor or touch sensor. Surroundingsensor component 904 is mounting ring 916, which, in turn, is surroundedby compressible gasket 932.

FIG. 9C shows that sensor cover 902 is adjacent display cover 912without a trim, and that display cover 912 is coupled to enclosureportion 910. Mounting ring 916 supports sensor cover 902 and ispositioned between sensor cover 902 and stiffener 905. Sensor assembly906 is coupled to display cover 912 by fastener 911. In someembodiments, mounting ring 916 is composed of a conductive material(e.g., metal) that capacitively senses the presence of a finger atexterior surface 913 of sensor cover 902. That is mounting ring 916 isconfigured to capacitively detect the presence of a finger throughsensor cover 902.

Compressible gasket 932 is positioned between sensor cover 902 and ledge918 of display cover 912. Compressible gasket 932 can be made of anysuitable compressible material, including one or more polymers oradhesives. In some embodiments, compressible gasket 932 is composed oflayers of compressible materials. Compressible gasket 932 can be in theform of a single piece or have multiple pieces. In some cases,compressible gasket 932 has a round ring shape that corresponds to around shape of sensor cover 902. When a user touches exterior surface913 of sensor cover 902, the thickness of compressible gasket 932reduces in the sensing direction 903. The force is transferred to firstcapacitive layer 922 a, thereby reducing a distance between firstcapacitive layer 922 a and second capacitive layer 922 b. This, in turn,causes a change in voltage or capacitance of touch sensor 922. Touchsensor 922 then generates a signal that activates one or more electricalcircuits of electronic device 900. Compressible gasket 932 is composedof a compliant material that provides a resistive force (oppositesensing direction 903) that returns sensor cover 902 back to itsun-pressed position. Once sensor cover 902 is back in its un-pressedposition, compressible gasket 932 returns to its full thickness.

FIGS. 10A-10D show cross-section and top views of sensor assembly 1006that is configured to vibrate, in accordance with some embodiments. FIG.10A shows a top view of a portion of electronic device 1000 havingsensor assembly 1006. FIG. 10B shows cross-section view at C-C of FIG.10A. FIG. 10C shows cross-section view D-D of FIG. 10B. FIG. 10D showscross section view E-E of FIG. 10B.

FIG. 10A shows piezoelectric actuator 1001 is located adjacent to sensorassembly 1006. Piezoelectric actuator 1001 is configured to vibratesensor assembly 1006 in response to a user touching sensor cover 1002.FIG. 10B shows that the perimeter of sensor cover 1002 is surrounded bymovable trim 1008, which is, in turn, surrounded by stationary trim1004. Movable trim 1008 can be composed of a compressible and compliantmaterial, such as a compliant polymer (e.g., silicone). Stationary trim1004 can be made of a relatively rigid material, such as metal. In someembodiments, stationary trim 1004 corresponds to a metal ring. In somecases, stationary trim 1004 has a chamfered edge that engages with achamfered edge of display cover 1012.

Seal 1011 is positioned between movable trim 1008 and stationary trim1004, and is configured to prevent entry of water or other liquidbetween movable trim 1008 and stationary trim 1004. In some embodiments,seal 1011 is composed of a compressible material, such as a flexiblepolymer. The shape and size of seal 1011 will be in accordance withspace limitations within sensor assembly 1006. In some embodiments, seal1011 has an O-ring shape. In some embodiments, movable trim 1008 hasgroove 1013 and stationary trim 1004 has groove 1018, which accommodateseal 1011. Sensor component 1014 can correspond to a portion of one ormore sensors, such as a fingerprint sensor that detects features of auser's fingerprint and/or a touch sensor that detects a user's touch.

Display cover 1012 is supported by cover frame 1015, which is, in turn,coupled to enclosure portion 1010. In some embodiments, cover frame 1015is composed of a reinforced glass fiber material, such as a glass-fiberreinforced with polyamide. Flange 1016 is positioned between displaycover 1012 is and cover frame 1015 and provides extra support fordisplay cover 1012. In some embodiments, flange 1016 is composed of arigid metal, such a stainless steel. Retaining post 1017 is positionedbelow sensor component 1014. Bracket 1019 supports stationary actuatorbeam 1020, which is coupled to piezoelectric actuator 1001. When sensorcomponent 1014 detects a touch from a user, sensor component 1014generates a signal that activates piezoelectric actuator 1001.Piezoelectric actuator 1001 then causes portions of sensor assembly 1006to move up and down (i.e., vibrate) along plane Z. For example,piezoelectric actuator 1001 can be configured to move sensor assembly1006 such that a user feels sensor cover 1002 vibrate in response to theinput. That is, sensor assembly 1006 can provide tactile feedback(output) that the user can feel, and that signals to the user thatsensor assembly 1006 has been activated.

The cross-section view of FIG. 10C shows retaining post 1017 can besecured to bracket 1019 by retaining clip 1025. Bracket 1019 is coupledto stationary trim 1004 via welds 1022. Retaining post 1017 is coupledto and supports movable trim 1008. The cross-section view of FIG. 10Dshows that stationary actuator beam 1020 is held stationary by bracket1019. Flexure dome 1021, which can be composed of resilient but stiffmaterial (e.g., metal), is coupled one end to connector 1024 via weld1026 and on another end to stationary actuator beam 1020 via weld 1030.Connector 1024 is coupled to piezoelectric actuator 1001 (not shown).When sensor component 1014 detects an input, sensor component 1014generates a signal that activates piezoelectric actuator 1001. Inresponse, piezoelectric actuator 1001 pushes connector 1024 in a pushdirection 1029. Connector 1024 slides along stationary actuator beam1020 and causes flexure dome 1021 to flex and push up on and releasestiffener 1027. Stiffener 1027 then causes movable trim 1008 compressand decompress, thereby causing sensor cover 1002 to move up and down(i.e., vibrate) along plane Z.

FIGS. 11A-11C show cross-section views of sensor assemblies havingdifferent sensing configurations, in accordance with some embodiments.The embodiments in FIGS. 11A-11C include architectures that allow fordetection of a force input in a less localized bases (i.e., not justdirectly underneath a sensor cover).

FIG. 11A shows electronic device 1100, which includes sensor assembly1106. Sensor assembly 1106 includes sensor cover 1102, which issurrounded by trim 1104 and positioned with an opening within displaycover 1112. Display cover 1112 is coupled to enclosure portion 1110.Bracket 1119 secures sensor assembly 1106 to enclosure portion 1110.Fingerprint sensor 1105 is configured to recognize fingerprint featuresof a user through sensor cover 1102. Sensor assembly 1106 has an activearea-based force-sensing configuration. In particular, when a usertouches or presses on sensor cover 1112, the force will deflect displaycover 1112, thereby reducing distance 1108 between display cover 1112and component 1114. This activates force sensor 1118 (e.g., a flexcapacitive sensor) that is positioned between display cover 1112 andcomponent 1114. This configuration allows for sensing in an area aroundsensor cover 1102.

FIG. 11B shows electronic device 1120, which includes sensor assembly1126. Sensor assembly 1126 includes sensor cover 1122, which issurrounded by trim 1124 and positioned with an opening within displaycover 1132. Display cover 1132 is coupled to enclosure portion 1130(which includes enclosure sections 1130 a and 1130 b). Bracket 1139secures sensor assembly 1126 to enclosure sections 1130 a and 1130 b.Fingerprint sensor 1125 is configured to recognize fingerprint featuresof a user through sensor cover 1122. Sensor assembly 1126 has a displaycover-to-enclosure sensing configuration. In particular, when a usertouches or presses on sensor cover 1122, the force will deflect displaycover 1132, thereby reducing distance 1128 between bracket 1139 andenclosure section 1130 a. This activates force sensor 1129 (e.g., a flexcapacitive sensor) that is positioned between bracket 1139 and enclosuresection 1130 a.

FIG. 11C shows electronic device 1140, which includes sensor assembly1146. Sensor assembly 1146 includes sensor cover 1142, which issurrounded by trim 1144 and positioned with an opening within displaycover 1152. Display cover 1152 is coupled to enclosure portion 1150.Bracket 1159 secures sensor assembly 1146 to enclosure portion 1150.Fingerprint sensor 1145 is configured to recognize fingerprint featuresof a user through sensor cover 1142. Sensor assembly 1146 has anexternal module-based force-sensing configuration. In particular, when auser touches or presses on sensor cover 1142, the force will deflectdisplay cover 1132, thereby reducing distance 1158 between sensoryassembly 1146 and bracket 1159. In some embodiments, distance 1158 isbetween stiffener 1148 of sensor assembly 1146 and bracket 1159. Thisactivates force sensor 1149 (e.g., a flex a capacitive sensor) that ispositioned between sensory assembly 1146 and bracket 1159.

FIG. 11D shows a perspective view of bracket 1159, which is incorporatedwithin the sensor assembly 1146 configuration of FIG. 11C, in accordancewith some embodiments. Bracket 1159 includes relief cut 1155, which canimprove signal from small relative deflections of display cover 1152. Insome embodiments, bracket 1159 can include conductive portion 1153(e.g., composed of metal) and non-conductive portion 1157 (e.g.,plastic), which electrically isolates the conductive portion 1153. Asshown, non-conductive portion 1157 can include openings 1151 forfasteners (not shown). Bracket 1159 is shown as a single piece. However,in other embodiments, a bracket having multiple pieces is used.

FIGS. 12A and 12B show cross-section views of a portion of an electronicdevice with sensor assembly 1206 before and during a bonding operation,respectively, in accordance with some embodiments. FIG. 12A shows sensorassembly 1206 prior to a bonding operation, where compliant member 1208is positioned between sensor cover 1202 and trim 1204. In someembodiments, compliant member 1208 includes one or more layers ofcompliant or resilient material, such a silicone or other polymer. Asdescribed above with compliant member 302 in FIG. 3, compliant member1208 can be one piece or include separate pieces (e.g., four circlesegment-shaped pieces to accommodate a rectangular-shaped sensorcomponent). It should be noted, however, that compliant member 1208 canhave any suitable shape and include any suitable number of pieces.Adhesive layer 1209 a is applied between compliant member 1208 andsensor cover 1202, and adhesive layer 1209 b is applied betweencompliant member 1208 and ledge 1218 of trim 1204, in order to securecompliant member 1208 to sensor cover 1202 and trim 1204. Adhesivelayers 1209 a and 1209 b can include any one or more suitable adhesivematerials, such as layers of heat-activated film, pressure-sensitiveadhesive, liquid adhesive, or other suitable adhesive material.

FIG. 12B shows sensor assembly 1206 during a bonding operation, where aforce is applied to sensor cover 1202 toward ledge 1218 of trim 1204. Asshown, if adhesive layers 1209 a and 1209 b are in liquid or semi-liquidform, adhesive layers 1209 a and 1209 b can cause overflow 1212 to formaround the sides of compliant member 1208. After adhesive layers 1209 aand 1209 b dry and harden, overflow 1212 can be stiffer than thematerial of compliant member 1208, which may reduce the compliance ofcompliant member 1208.

FIGS. 13A-13F show sensor assembly configurations for preventingadhesive overflow 1212 from occurring. FIG. 13A shows a top view and across-section A-A view of a portion of an electronic device havingsensor assembly 1306. The top view shows sensor assembly 1306 withoutsensor cover 1302, thereby exposing sensor component 1305 (e.g.,fingerprint sensor). The cross-section A-A view shows that compliantmember 1308 is positioned between sensor cover 1302 and ledge 1307 oftrim 1304. The thickness t1 of adhesive layer 1309 a and thickness t2 ofadhesive layer 1309 b are each thin enough to eliminate or reduce theoccurrence of overflow, yet are thick enough to adhere compliant member1308 to sensor cover 1302 and trim 1304. In some embodiments, the totalthickness (t1+t2) of adhesive layers 1309 a and 1309 b is about 20micrometers.

FIG. 13B shows a top view and a cross-section B-B view of a portion ofan electronic device having sensor assembly 1316. The top view showssensor assembly 1316 without sensor cover 1312, thereby exposing sensorcomponent 1315 (e.g., fingerprint sensor). The cross-section B-B viewshows compliant member 1318 positioned between sensor cover 1312 andledge 1307 of trim 1314. In this embodiment, the total thickness (t3+t4)of adhesive layers 1319 a and 1319 b, respectively, is larger than thetotal thickness (t1+t2) of adhesive layers 1309 a and 1309 b describedabove with reference to FIG. 13A. This greater amount of adhesivematerial can increase the bond strength of compliant member 1318 tosensor cover 1302 and trim 1304 compared to thinner adhesive layers. Insome embodiments, the total thickness (t3+t4) is about 20 micrometers.In some cases, however, these larger thicknesses t3 and t4 can increasethe risk of overflow around the edges of compliant member 1318, such asdescribed above with reference to FIG. 2B.

FIG. 13C shows a top view and a cross-section C-C view of a portion ofan electronic device having sensor assembly 1326. The top view showssensor assembly 1326 without sensor cover 1322, thereby exposing sensorcomponent 1325 (e.g., fingerprint sensor). The cross-section C-C viewshows compliant member 1328 positioned between sensor cover 1322 andledge 1327 of trim 1324. Prior to applying a force during a bondingoperation (e.g., see FIG. 2B), adhesive layer 1329 a covers less surfacearea of compliant member 1328 and has lesser volume of adhesive materialthan adhesive layer 1329 b. This configuration can eliminate or reducethe amount of overflow at the top edges of compliant member 1328. Inparticular, when a force is applied during a bonding operation, bothadhesive layers 1329 a and 1329 b will spread toward the edges ofcompliant member 1328. Since adhesive layer 1329 a has a lesser volume,adhesive layer 1329 a will not overflow or will overflow very little.This configuration can be useful in embodiments where less adhesivematerial is needed to adequately adhere compliant member 1328 to sensorcover 1322 compare to an amount of adhesive material needed toadequately adhere compliant member 1328 to trim 1324.

FIG. 13D shows a top view and a cross-section D-D view of a portion ofan electronic device having sensor assembly 1336. The top view showssensor assembly without sensor cover 1332, thereby exposing sensorcomponent 1335 (e.g., fingerprint sensor). The cross-section D-D viewshows compliant member 1338 positioned between sensor cover 1332 andledge 1337 of trim 1334. In this embodiment, both adhesive layers 1339 aand 1339 b cover less surface area of compliant member 1338 and havelesser volume of adhesive than the embodiment of FIG. 3A or FIG. 3B.This configuration can eliminate or reduce the amount of overflow at thetop and bottom edges of compliant member 1338 once a force is appliedduring a bonding operation (see FIG. 2B). Care should be taken, however,to assure that adhesive layers 1339 a and 1339 b have enough volume toadequately bond compliant member 1338 with sensor cover 1332 and trim1334. In some cases, this may mean increasing tolerances during themanufacturing process.

FIG. 13E shows a top view and a cross-section E-E view of a portion ofan electronic device having sensor assembly 1346. The top view showssensor assembly 1346 without sensor cover 1342, thereby exposing sensorcomponent 1345 (e.g., fingerprint sensor). The cross-section E-E viewshows compliant member 1348 positioned between sensor cover 1342 andledge 1347 of trim 1344. In this embodiment, adhesive layers 1349 a and1349 b are in a staggered configuration. In particular, adhesive layer1349 a is positioned closer to first end 1341 of compliant member 1348,and adhesive layer 1349 b is positioned closer to second end 1343 ofcompliant member 1348. In some cases, adhesive layers 1349 a and 1349 bdo not over lap at middle portion 1340 of compliant member 1348. When aforce is applied during a bonding operation, any overflow will bedirected to opposing ends of compliant member 1348 (i.e., first end 1341and second end 1343). This prevents joining of any of the overflow ofadhesive layers 1349 a and 1349 b at the edges of compliant member 1348.Note that care should be taken to assure that the load applied duringthe bonding operation is even despite the staggered adhesive layerconfiguration.

FIG. 13F shows a top view and a cross-section F-F view of a portion ofan electronic device having sensor assembly 1356. The top view showssensor assembly 1356 without sensor cover 1352, thereby exposing sensorcomponent 1355 (e.g., fingerprint sensor). The cross-section F-F viewshows compliant member 1358 positioned between sensor cover 1352 andledge 1357 of trim 1354. In this embodiment, compliant member 1358includes recesses 1353, which correspond to channels that provide spacefor adhesive layer 1259 a to flow into during the bonding operation(e.g., as shown in FIG. 12B), thereby preventing overflow of adhesivematerial around the outer edges of compliant member 1358. Furthermore,this configuration can enhance an even distribution of adhesive layer1259 a at the surface of compliant member 1358. Recesses 1353 can haveany suitable shape and are not limited to the elongated channel shapesshown in FIG. 13F. For example, the recesses can be circular,triangular, rectangular, and/or chevron shaped. In some embodiments,recesses are on an opposing side of compliant member 1358 in order toaccommodate adhesive layer 1259 b. In some embodiments, two sides ofcompliant member 1358 include recesses in order to accommodate adhesivelayer 1259 a and adhesive layer 1259 b.

The foregoing description, for purposes of explanation, uses specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not intended to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. An electronic device, comprising: a housingcomprising a wall, the housing defining a first opening, a secondopening, and an internal volume; a speaker disposed at least partiallywithin the internal volume and positioned to direct sound through thefirst opening; a sensor assembly positioned within the second opening,the sensor assembly comprising: a sensor cover defining an accessibleand movable outer surface; and a movement sensor capable of detecting afirst movement of the outer surface and providing a first signal inresponse to the first movement, the movement sensor further capable ofdetecting a second movement of the outer surface and providing a secondsignal in response to the second movement, the second movement being ina different direction than the first movement; and an acoustic componentin communication with the movement sensor and capable of providing,based on the first signal, an acoustic feedback.
 2. The wearableelectronic device of claim 1, wherein the acoustic feedback mimics asound of a mechanical component.
 3. The wearable electronic device ofclaim 2, wherein the acoustic component produces a clicking sound inresponse to the first signal.
 4. The wearable electronic device of claim1, wherein the acoustic feedback is commensurate with a distance of thefirst movement.
 5. The wearable electronic device of claim 1, whereinthe wall is a side wall of the housing.
 6. The wearable electronicdevice of claim 1, wherein the accessible and movable outer surface isoffset from an exterior surface defined by the wall.
 7. The wearableelectronic device of claim 1, wherein the movement sensor is a solidstate sensor.
 8. The wearable electronic device of claim 1, wherein themovement sensor is capable of detecting a push input on the sensorcover.
 9. The wearable electronic device of claim 1, wherein themovement sensor is capable of detecting a motion of the sensor cover.10. The wearable electronic device of claim 1, wherein the sensorassembly comprises a pre-assembled module.
 11. The wearable electronicdevice of claim 1, wherein the speaker is positioned proximate to thesensor assembly.
 11. A portable electronic device, comprising: a housingcarrying a speaker and defining an opening; a processor carried by thehousing; a sensor assembly carried by the housing and in communicationwith the processor, the sensor assembly having a movement sensor and asensor cover, the sensor assembly disposed within the opening, wherein:a first movement of the sensor cover in a first direction, in accordancewith a first input applied by a user, is detectable by the movementsensor; a second movement of the sensor cover in a second directiondifferent than the first direction, in accordance with a second inputapplied by a user, is detectable by the movement sensor; and the sensorassembly is capable of providing a first signal to the processorcorresponding to a detection of the first movement exceeding a firstthreshold distance and a second signal to the processor corresponding toa detection distance of the second movement exceeding a second thresholddistance; and an acoustic component in communication with the processor,the acoustic component capable of providing, based on the first signalindicative of the first movement exceeding the threshold distance, anacoustic feedback.
 12. The portable electronic device of claim 11,wherein the housing comprises metal.
 13. The portable electronic deviceof claim 11, wherein the speaker is a first speaker and the housingcarries a second speaker.
 14. The portable electronic device of claim11, wherein the housing is non-transparent.
 15. The portable electronicdevice of claim 11, wherein the movement sensor is capable of detectinga push input on the sensor cover.
 16. A wearable electronic device,comprising: a housing comprising a side wall at least partially defininga housing opening and a side wall opening; a processor carried by thehousing; a speaker carrier by the housing and positioned to direct soundthrough the housing opening; a pre-assembled sensor assembly carried bythe housing in the side wall opening and in communication with theprocessor, the sensor assembly comprising: a sensor cover disposedwithin the side wall opening and having an accessible and movable outersurface; and a movement sensor capable of detecting a first movement anda second movement of the outer surface and providing a first signal anda second signal in response to the first movement or the secondmovement, respectively, the first movement being in a first directionand the second movement being in a second direction different than thefirst direction; and an acoustic component in communication with theprocessor and capable of providing an acoustic feedback in response to acommand from the processor based on the first signal.
 17. The wearableelectronic device of claim 16, wherein the acoustic component is capableof producing a clicking sound.
 18. The wearable electronic device ofclaim 16, wherein the movement sensor is a capacitive sensor.
 19. Thewearable electronic device of claim 16, wherein the movement sensor iscapable of detecting a motion of the sensor cover.
 20. The wearableelectronic device of claim 16, wherein the acoustic component isproximate to the sensor assembly.